Q1 Electrical Characteristics (TJ=25°C unless otherwise noted)
Conditions
BVDSS
IGSS
RDS(ON)
VSD
Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
Gate-Body leakage current
Static Drain-Source On-Resistance
VDS=VGS, ID=250µA
Forward Transconductance
VGS=4.5V, ID=20A
IS=1A,VGS=0V
TJ=55°C
DYNAMIC PARAMETERS
Coss Output Capacitance
Rg Gate resistance
f=1MHz
Qg(10V)
Qgs
tD(on)
tD(off)
trr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On Rise Time
VGS=10V, VDS=15V, RL=0.75Ω,
Turn-Off Fall Time
Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs
Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
30
0.6
1.8
6.3
67
820
40
13
2
6.5
17
11
Max Units
5
2.2
7.6
1
V
nA
mΩ
S
A
pF
1.8 Ω
nC
nC
ns
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power
dissipation PDSM is based on R θJA t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any given application depends on
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature TJ(MAX)=150°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
Rev.1.0: October 2014
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